Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Corner bond technology enhances the reliability of embedded products under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications.
How corner bond works
Transcend's corner bond is an economic bonding solution of applying fluid encapsulant or liquid epoxy around the perimeter of a silicon chip, leaving just one gap unapplied. This is to allow space for future thermal expansion. The corner bond adhesive is then cured with UV light to form a structural bond between the silicon chip and the PCB.
Main functions
Corner bond is commonly used for ball grid array (BGA) based storage for applications such as handheld devices, which must pass drop or tumble tests.
When a BGA device is exposed to repeated heating and cooling cycles, a BGA chip will expand or contract at a different rate than that of the underlying substrate, due to the difference in each material's coefficient of thermal expansion. This differential creates mechanical stress on the device's solder joints.
Corner bond is used as a stress relieving agent, evenly distributing the expansion and contraction effects. By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Transcend quality
Transcend implements Corner Bond technology on SSDs using in-house dispensing equipment, with drop and reliability testing conducted during the design and validation phases to ensure optimal quality and durability. Customization is available upon customer request.